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济南发光字的工艺介绍

来源:http://www.hongchenad.cn    发布时间:2020-07-27

济南发光字是一种新兴照明能量,由于其比较“娇气”所以在济南发光字封装环境是比较严苛的,全程流程都需求防ESD无尘,且温度要控制在23±2℃,湿度要控制50±10%的环境中进行。

Jinan luminous character is a new type of lighting energy. Because of its "delicate" characteristics, the packaging environment of Jinan luminous word is very strict. The whole process needs to be ESD free, and the temperature should be controlled at 23 ± 2 ℃ and the humidity should be controlled at 50 ± 10%.
一.工艺:
1、 Process:
a) 清洗:选用超声波清洗PCB或LED支架,并烘干。
a) Cleaning: select ultrasonic cleaning PCB or LED bracket, and dry.
b) 装架:在LED管芯(大圆片)底部电极备上银胶后进行扩张,将扩张后的管芯(大圆片)安置在刺晶台上,在显微镜下用刺晶笔将管芯一个一个安装在PCB或LED支架相应的焊盘上,随后进行烧结使银胶固化。
b) Mounting: after silver glue is prepared on the bottom electrode of LED die (large wafer), the expanded die (large wafer) is placed on the spinel stage. Under the microscope, the die is installed on the corresponding pad of PCB or LED bracket one by one with a stylus, and then sintered to solidify the silver glue.
c)压焊:用铝丝或金丝焊机将电极连接到LED管芯上,以作电流注入的引线。LED直接安装在PCB上的,一般选用铝丝焊机。(制造白光TOP-LED需求金线焊机)
c) Pressure welding: aluminum wire or gold wire welding machine is used to connect the electrode to the LED tube core for current injection. Led directly installed on the PCB, the general selection of aluminum wire welding machine. (manufacturing white top-led needs gold wire welder)
d)封装:经过点胶,用环氧将LED管芯和焊线维护起来。在PCB板上点胶,对固化后胶体形状有严格要求,这直接关系到背光源制品的出光亮度。这道工序还将承担点荧光粉(白光LED)的使命。
d) Packaging: after dispensing, the LED die and solder wire are maintained with epoxy resin. There are strict requirements for the colloid shape after curing when dispensing glue on PCB board, which is directly related to the brightness of backlight products. This process will also undertake the mission of phosphor (white LED).
e)焊接:假如背光源是选用SMD-LED或其它已封装的LED,则在安装工艺之前,需求将LED焊接到PCB板上。
e) Welding: if the backlight is smd-led or other packaged led, it is required to weld the led to the PCB before the installation process.
f)切膜:用冲床模切背光源所需的各种分散膜、反光膜等。
f) Cutting film: use punch die cutting back light source of various dispersion film, reflective film, etc.
g)安装:依据图纸要求,将背光源的各种资料手工安装正确的方位。
g) Installation: according to the requirements of the drawings, manually install the backlight in the correct direction.
h)测验:检查背光源光电参数及出光均匀性是否良好。
h) Test: check the photoelectric parameters and light uniformity of backlight.
I)包装:将制品按要求包装、入库。
1) Packaging: packing and warehousing the products according to the requirements.
二、封装工艺
2、 Packaging process
1. 济南发光字的封装的使命
1. The mission of Jinan luminous word packaging
是将外引线连接到LED芯片的电极上,一起维护好LED芯片,而且起到提高光取出功率的作用。关键工序有装架、压焊、封装。
It is to connect the external lead to the electrode of LED chip, maintain the LED chip together, and improve the power of light extraction. The key processes are mounting, welding and packaging.
2. LED封装方式
2. LED packaging mode
济南发光字封装方式可以说是形形色色,首要依据不同的使用场合选用相应的外形尺寸,散热对策和出光效果。济南发光字按封装方式分类有Lamp-LED、TOP-LED、Side-LED、SMD-LED、High-Power-LED等。
Jinan luminous word packaging can be said to be various, according to different use occasions to choose the corresponding size, heat dissipation measures and lighting effect. Jinan luminous words are classified into lamp LED, top led, side LED, SMD LED, high power LED, etc.

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